 

Visit CIP at OFC / San Diego, USA / 24-26 March 2009 Booth No 393 more info
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CIP Technolgies Launches HyBoard™ Hybrid Photonic Integration Platform at ECOC 2008.
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info Press Release
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Extensive facilities & capability include design, fabrication, analysis, packaging & system testing to support world-leading device innovations. Internationally recognised CIP is highly experienced in commercial Wafer Fabrication.
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Detail as much information on your requirements as possible. We will respond within 2 working days. email: sales@ciphotonics.com
 
Alongside
commercial activities CIP also operates
to promote work and collaboration between academia and industry.
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