 

Visit CIP at ECOC / 21st - 23rd September 2009 / Vienna / Booth Number 700 more info
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CIP Technolgies Launches HyBoard™ Hybrid Photonic Integration Platform at ECOC 2008. more
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Groundbreaking thermo-photovoltaic devices set new record for energy conversion efficiency more
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Extensive facilities & capability include design, fabrication, analysis, packaging & system testing to support world-leading device innovations. Internationally recognised CIP is highly experienced in commercial Wafer Fabrication.
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Detail as much information on your requirements as possible. We will respond within 2 working days. email: sales@ciphotonics.com
 
Alongside
commercial activities CIP also operates
to promote work and collaboration between academia and industry.
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