Wafer fabrication

CIP offers leading edge R&D through to pilot production of III/V InP wafers or devices incorporating sub-micron feature sizes.The integrated nature of the facility enables us to offer a complete package that includes epitaxial
growth, device definition, overgrowth and subsequent processing to produce fully fabricated and tested chips.

The Centre has a fully functional fabrication facility that includes E-beam direct write, photolithography, PECVD dielectric deposition, metal deposition by sputtering or evaporation as well as a wide range of analysis tools including a new field emission SEM system.

CIP can, if required, also provide a bespoke device design service for advanced device structures and a prototype device packaging service (see data sheets for more details).

Experience

Scientists and engineers at CIP have extensive experience in R&D, technology transfer from R&D to production and in the full scale manufacture of a range of device structures. A number of the key CIP scientists were also
instrumental in the early development of highly reliable BH laser and planar PIN photodiode processes that were successfully transferred into manufacture.

Process Examples/Capabilities

CIP has a fully equipped facility with all the stable characterised processes required to meet your needs.

These include:

• 4 mask aligners for photolithography including a EVG620 with cassette handling and a Cambridge E-beam direct write system for nanolithography PECVD Oxide and Nitride deposition
• Metal deposition by both sputtering and E-beam evaporation
• Reactive ion etching of III-V using methane hydrogen and of dielectrics using a range of gases including CF4, C2F6 and SF6 and experience in a wide range of wet chemical etches for both III-V materials and dielectrics
• SEM analysis including EBIC and EDAX on a Hitachi S4700 field emission machine
• Wafer thinning and dicing
• On wafer and bar level die testing
• Chip level reliability testing at elevated temperatures up to 300°C

A PDF version of this Data Sheet is available below (Approx 720kB)

Wafer Fabrication PDF

Visit CIP at OFC / San Diego, USA / 24-26 March 2009 Booth No 393 more info

CIP Technolgies Launches HyBoard™ Hybrid Photonic Integration Platform at ECOC 2008.
more info Press Release

email:
sales@ciphotonics.com

Detailing as much information on your quote requirements as possible. We will respond within 2 working days.