Prototype
Packaging
Optical
packaging and integration is a key enabler in the development
of components, devices and sub-systems that have to be tested
in any representative system or application. CIP has a very
broad range of capabilities in packaging that reflects the
highly diverse nature of the challenges presented by the different
component technologies.
Experience
and Capabilities
The
personnel at CIP have been developing bespoke photonics packaging
solutions for research and development prototypes for over
20 years. CIP can provide a one shop solution to the packaging
of optoelectronic components
including package design, optical fibre and fibre array pigtailing,
free space optical assemblies, hybrid device integration as well
as providing consultancy in managing the transition between research
packaging and manufacturing package solutions.
We
have expertise in:
- Laser
welding of fibre pigtails
- High
speed RF packaging with bandwidths up to 40 GHz
- Wire
and mesh bonding
- Integration
of hybrid optoelectronic assemblies
- Passive
assembly and passive fibre pigtailing for low cost packaging
- Free
space optical assemblies
- Packaging
with V-groove arrays
- Bespoke
package design and assembly
- Lens-ended
fibre assemblies
- Electrical
probing and RF testing
Facilities & Equipment
- Eutectic
die bonding
- Thermocompression
Au wire bonding
- Thermosonic
Au wire bonding
- Deep
access Au wire bonding
- Deep
access Al/Au ribbon bonding
- Fibre
align & fix laser welding system
- Prototype
hybrid assembly facilities
- Fibre
pigtail sub-assembly manufacture
- UV & thermal
cure epoxy systems
- Die
shear & wire pull test facilities
- Pre & post
packaged device testing
- Burn-in
and reliability testing
A
PDF version of this Data Sheet is available below (Approx
240kB)
 Prototype
Packaging PDF
|
 
Visit CIP at OFC / San Diego, USA / 24-26 March 2009 Booth No 393 more info
CIP Technolgies Launches HyBoard™ Hybrid Photonic Integration Platform at ECOC 2008.
more
info Press Release
email:
sales@ciphotonics.com
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