cip

Planar Silica

Planar Silica Waveguides

CIP provides world leading device design consultancy, contract R&D and pilot production for a large range of passive planar components. Our growth and fabrication facilities have been used to provide high specification and high reliability devices.We also have a full range of support activities such as test, measurement and packaging.

Experience and Capabilities

Engineers and scientists at CIP have a wealth of experience gained from working on planar silica waveguide materials and devices for over 14
years. CIP's engineers have developed and produced a whole host of passive components, from simple splitters and couplers through long path length delay line structures to complex arrayed waveguide gratings.

CIP offers a service which stretches from material design, through mask layout through to full fabrication, testing and packaging.

CIP can also demonstrate extensive successful experience of transferring all processes involved in deposition and processing to industrial partners.

CIP are also pioneering the research into hybrid integration of active semiconductor devices with passive planar waveguides. Complex optical functional components such as all-optical regenerators, wavelength converters and XOR gates have all been designed and demonstrated by CIP
engineers. This activity benefits from the close coupling of the active semiconductor device design and fabrication work at CIP enabling the
optimisation of active and passive devices for hybrid integration.

We also have extensive experience in rare earth doping, photosensitivity and photoconductivity in planar silica waveguides.

Facilities & Equipment

CIP offers a fully equipped and staffed facility to provide a complete capability for planar silica waveguide devices

  • Waveguide device design
  • Layer deposition
  • Index & thickness measurement
  • Device fabrication
  • Dicing and polishing
  • Packaging
  • Testing

CIP facilities include two Flame Hydrolysis Deposition (FHD) systems, for 4" and 6" wafers. There is also an atmospheric pressure thermal oxidation furnace capable of growing up to 16 microns of thermal oxide.

 

Planar Silica PDF

OFC 2009

Visit CIP at OFC / San Diego, USA / 24-26 March 2009 Booth No 393 more info


CIP Technologies HyBoard TM Hybrid Photonic Integration Platform
CIP Technolgies Launches HyBoard™ Hybrid Photonic Integration Platform at ECOC 2008.
more info Press Release


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