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In the News

2006 Wafertech.co.uk

Wafer Technology Shares in DTI Award to Develop new InP based Thermophotovoltaic Devices

Wafer Technology is pleased to announce its participation in a new project to develop high efficiency ThermoPhotoVoltaic (TPV) cell technology based on InP substrate material. In partnership with the Centre for Integrated Photonics and Oxford University, funding from the DTI and EPSRC through the Technology Programme will support a three year project to develop low cost high efficiency TPV cells based on the InGaAs/InP material system.

Wafer Technology will be responsible for developing a new range of low cost InP substrate technologies. CIP will perform epitaxial growth, device fabrication and testing, and the University of Oxford will engage in cell design and the fabrication of fully packaged TPV modules.

Ray Brunton, the Company’s Crystal Growth Operations Manager commented “As Europe’s leading manufacturer of InP substrates and the main producer worldwide of GaSb used in existing TPV devices, Wafer Technology has a long standing involvement in TPV technology through other collaborative projects, and is ideally placed to assess, control and exploit the effects of starting material quality and price on the performance and cost of TPV devices”

Minister for Science and Innovation Lord Sainsbury said: “The Technology Strategy helps develop competitive advantage for British businesses so they can be at the cutting edge of the global knowledge-based economy.

“It is about encouraging collaboration in order that companies can invest for the future and develop new world-beating products.

“I congratulate the project participants and wish them every success.”

For any notes to editors

THE TECHNOLOGY PROGRAMME

This project is part-funded by a Collaborative R&D grant under the Technology Programme.

The Technology Programme, launched in 2004, is investing directly in new and emerging technologies identified by the Technology Strategy Board, and has been designed to help businesses work collaboratively with each other or with academic partners to develop technologies that will underpin products and services of the future. The Technology Programme provides funding using two of the DTI's business support products: Collaborative Research & Development and Knowledge Transfer Networks.

To date the Technology Programme has allocated more than £300m to Collaborative R&D competitions, awarding grants ranging from £30,000 to £2.2 million. Around 220 projects have been funded spread over 25 technology areas. Eighteen (18) Knowledge Transfer Networks have also been established with funding of around £40m over 3 years.

Further information can be found at: www.dti.gov.uk/technologyprogramme.

OFC 2009

Visit CIP at OFC / San Diego, USA / 24-26 March 2009 Booth No 393 more info


CIP Technologies HyBoard TM Hybrid Photonic Integration Platform
CIP Technolgies Launches HyBoard™ Hybrid Photonic Integration Platform at ECOC 2008.
more info Press Release


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