Careers
> Technical Apprentice
> Hybrid Device Design Engineer
> Packaging Engineer
> University of Huddersfield
Technical Apprentice
CIP is a young successful innovative R&D business based at Adastral Park, Martlesham Heath making highly specialised semiconductor optical devices. Our products sell in over 25 countries around the world and are mainly used in the telecommunications sector. We are currently expanding and looking to appoint two scientific/technical apprentices to add to our team of around 50 people.
Roles
Within CIP, there are a number of different activities, such as device fabrication in the cleanroom, optical coating deposition, test and measurement and reliability testing. Apprentices will be given experience of working in a number of these areas.
Skills/Qualifications Required
CIP is looking to recruit individuals with an interest in science and engineering, who are enthusiastic, reliable, conscientious, highly motivated, dexterous and show good attention to detail and are able to work flexibly and well as part of a team. Good A levels in Maths and Science, and GCSE in English.
Training
Training offered will be based around on the job training. In addition, as an apprentice, opportunities for distance learning to pass relevant vocational training examinations will be provided.
Personal Attributes required
- Seeks to share ideas and information with others.
- Orientated to completing tasks
- Positive outlook.Supportive of the culture and ethos of CIP.
- Proactive and flexible coupled to a careful and methodical approach to work.
- Works well as a member of assigned team.
- Self confident.
- Attention to detail.
- Able to process data, good at note taking and report writing
APPLICATIONS:
Please apply to HR, CIP Ltd, B55, Adastral Park, Martlesham Heath, Ipswich. IP5 3RE
or email hr@ciphotonics.com
CLOSING DATE: 24th September 2010
>> Back to Top
Hybrid Device Design Engineer
The job holder will be part of the Hybrid Integration group. This small team requires flexible working across functional boundaries. The work for this position will come from within CIP and also from external organisations. There will be direct contact with external customers, and with other teams within CIP.
Main Responsibilities
- Hybrid optoelectronic device design and modelling including passive silica on silicon waveguides and silicon micromachined submounts with indium phosphide active components.
- Work with customers to translate their specifications into workable designs.
- Carry out design work at physical and system level and execute build via Operations teams to deliver product to customers against agreed specifications, cost and delivery times.
- Manage assigned design projects to deliver design to agreed specifications, cost and delivery times.
- Mask design and layout in GDSII format
- Provide design support to troubleshoot process issues.
- Carry out thermal modelling and simulation on hybrid devices
Skills/Qualifications Required
- BSc in relevant physical science plus 3 years experience of design active or passive devices.
- Several years experience of device integration and systems level characterisation.
- Use of commercial modelling software and mask layout software.
- Experience of working directly with customers to turn requests into device specifications.
- Project management experienceExperience in Hybrid design, optical waveguide design, fabrication process design, mask design and characterisation of finished devices.
- Experience of formal design techniques
Personal Attributes Required
- Seeks to share ideas and information with others.
- Orientated to completing tasks
- Positive outlook.
- Supportive of the culture and ethos of CIP.
- Proactive and flexible coupled to a careful and methodical approach to work.
- Works well as a member of assigned team.
- Self confident and attention to detail.
Preferred
- PhD in relevant physical science.
- Experience of commercial optical software packages such as RSoft, MaskEngineer, Fimmwave, Fimmprop, Coventor, and finite element analysis tools.
- Experience in script programming – eg Python, version control tools, would also be an advantage.
- AWG design experience.
Applications
To apply please send your CV and covering letter to: HR Department, CIP Technologies, B55 Adastral Park, Martlesham Heath, Ipswich. IP5 3RE.or hr@ciphotonics.com.
CLOSING DATE: 13th August 2010
>> Back to Top
PACKAGING ENGINEER
CIP is looking to recruit two full time Packaging Engineers to take on a hands on role as part of the Packaging and Integration team. This small team requires flexible working across functional boundaries. The work for these positions will come from within CIP and also from external organisations. There will be direct contact with external customers, and with other teams within CIP.
Main Responsibilities
- Work with device designers to optimise packaging designs to enhance product performance and manufacturability
- Carry out the fibre alignment, assembly, free space optical assemblies, wire and die bonding, and packaging of optoelectronic components.
- Provide engineering support to troubleshoot process issues.
- Establish equipment set up and packaging processes for new component types
- Design and maintain quality and safety systems relating to the work area.
- Maintain component stocks and process records.
Skills/Qualifications Required
- HNC or higher in Mechanical engineering
- Excellent manual dexterity and attention to detail
- Excellent numeracy skills
- Willingness to travel, if required
- Good knowledge of software tools
Preferred
- Experience in optical and electronic device measurements.
- Relevant experience in optoelectronic packaging.
Personal Attributes required
- Seeks to share ideas and information with others.
- Orientated to completing tasks
- Positive outlook.
- Supportive of the culture and ethos of CIP.
- Proactive and flexible coupled to a careful and methodical approach to work.
- Works well as a member of assigned team.
- Self confident.
- Attention to detail.
- Able to process data, good at note taking and report writing
APPLICATIONS:
Please apply to HR, CIP Ltd, B55, Adastral Park, Martlesham Heath, Ipswich. IP5 3RE or email lsh@ciphotonics.com
CLOSING DATE: 13th August 2010
>> Back to Top
UNIVERSITY OF HUDDERSFIELD
ERC PhD
Design, fabrication and assembling technology for creating original and advanced self-calibrated chip devices for measurements of ultra/nano precision surfaces.
Supervisor name: Prof. Xiangqian Jane Jiang / Dr. Graeme Maxwell
Application deadline: 1st August 2010
Project description:
This is exciting opportunity to conduct research as part of a multi-disciplinary project of integrated photonics, microfabrication, and surface measurements. This project aims to integrate optical elements including tuneable lasers, optical filterss, detectors and other corresponding optical components into a single measurement interferometry chip; explore the metrological properties including flexibility, stability and repeatability of the chip; and create a miniaturized optical instrument. This instrument will be used for absolute displacement measurement and surface-profile measurement in the presence of environmental noise.
Jointly supervised by Dr. Graeme Maxwell CIP Technologies, the candidate will work at the Centre for Integrated Photonics Ltd, based at Adastral Park, Nr Ipswich, Suffolk, and the School of Computing and Engineering of University of Huddersfield.
Students who have, or are expected to attain, a 1st honour degree in Engineering or a related subject are invited to apply. A relevant Master’s degree is desirable. The expected starting date is July 2010.
hr@ciphotonics.com
>> Back to Top
CIP
is dedicated to being a state of the art R&D resource to
commercial, academic and collaborative E.U. groups in a broad
range of technologies derived from fundamental photonics research
expertise.
CIP
is a growing organisation and may require individuals with
specific skills in the future.
If
you would like your details kept on file in case such an
opportunity arises send your CV
by e-mail (include your current salary) to:
hr@ciphotonics.com
CIP
is an equal opportunities employer and as such invites applications
from any suitably qualified person.
>> Back to Top
|
